Peking University’s 3-Layer Cooling System Handles Record Chip Heat Loads
Peking University engineers built a three-layer microfluidic cooling device that manages 3,000 W/cm² heat flux with just 0.9 W/cm² pumping power. Using manifold, microjet, and microchannel layers, it dissipates heat efficiently, promising a leap toward cooler, smaller, and more power-efficient chip designs.
